SAC305/INDIUM10.1HF/TYPE4/89

Introduction 
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to have ultra-low voiding, including for designs that incorporate large ground pads otherwise known as bottom termination components (BTCs). BTCs include packages such as QFNs, DPAKs, and MOSFETs. The flux chemistry is specifically engineered to improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance while also providing excellent wetting, solder beading, solder balling, and slump to meet IPC specifications. It is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. 

 Features 
Ultra-low voiding, including bottom termination (BTC) assemblies 

High ECM performance under low standoff components 

Outstanding solder beading, very low bridging, slump, solder balling, and head-in-pillow 

Excellent wetting to fresh and aged common metallizations and surface finishes, including, but not limited to: 
OSP 
Immersion Sn 
Immersion Ag 
ENIG 

Exceptional printing — high transfer efficiency and low variation 

Halogen-free per IEC 61249-2-21, test method EN14582 
 Alloys 
Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-free alloys that cover a broad range of melting temperatures. Type 3 and Type 4 powders are standard offerings with Pb-free alloys. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application. Standard product offerings are detailed in the specifications table.